ALEXANDRIA, Va., July 15 -- United States Patent no. 12,666,983, issued on June 23, was assigned to Sony Group Corp. (Tokyo). "Semiconductor device" was invented by Koichi Ono (Kanagawa, Japan) and M... Read More
ALEXANDRIA, Va., July 15 -- United States Patent no. 12,666,984, issued on June 23, was assigned to FUJI ELECTRIC Co. LTD. (Kawasaki, Japan). "Semiconductor apparatus" was invented by Akio Yamano (Fr... Read More
ALEXANDRIA, Va., July 15 -- United States Patent no. 12,666,985, issued on June 23, was assigned to NXP USA Inc. (Austin, Texas). "Semiconductor device with hybrid routing and method therefor" was in... Read More
ALEXANDRIA, Va., July 15 -- United States Patent no. 12,666,986, issued on June 23, was assigned to SILICONWARE PRECISION INDUSTRIES Co. LTD. (Taichung City, Taiwan). "Electronic package and manufact... Read More
ALEXANDRIA, Va., July 15 -- United States Patent no. 12,666,987, issued on June 23, was assigned to ROHM Co. LTD. (Kyoto, Japan). "Semiconductor apparatus" was invented by Tan Nhat Hoang (Kyoto, Japa... Read More
ALEXANDRIA, Va., July 15 -- United States Patent no. 12,666,988, issued on June 23, was assigned to Micron Technology Inc. (Boise, Idaho). "Semiconductor device assemblies with cavity-embedded cubes ... Read More
ALEXANDRIA, Va., July 15 -- United States Patent no. 12,666,989, issued on June 23, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Gyeonggi-do, South Korea). "Semiconductor package" was invented by Yo... Read More
ALEXANDRIA, Va., July 15 -- United States Patent no. 12,666,990, issued on June 23, was assigned to Micron Technology Inc. (Boise, Idaho). "Connecting semiconductor dies through traces" was invented ... Read More
ALEXANDRIA, Va., July 15 -- United States Patent no. 12,666,991, issued on June 23, was assigned to QUALCOMM Inc. (San Diego). "Integrated device comprising pillar interconnects with variable widths"... Read More
ALEXANDRIA, Va., July 15 -- United States Patent no. 12,666,992, issued on June 23, was assigned to Unimicron Technology Corp. (Taoyuan, Taiwan). "Circuit board with embedded chip and method of manuf... Read More